Нижегородский государственный университет им.Н.И.Лобачевского.
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Вышел очередной номер электронного журнала IntelTechnology
Intel Technology Journal
Technology Journal—May 2006, Vol. 10, Issue
In This Issue
Intel® Centrino® Duo Mobile Technology
Learn about the challenges of building a general-purpose mobile core that provides the highest level of performance while enabling the system to fit into different thermal envelopes
System, Power and Thermals
Take a closer look at the first mobile core to implement Core Multi- Processor (CMP) technology on one die, thus maximizing performance and minimizing power consumption.
Read how power and thermal control methods have become a driving factor in the architecture and design process of platforms based on the Intel® Core™ Duo processor.
Examine techniques that greatly improve the memory power/thermal management in thin and light platforms built on Intel® Centrino® Duo mobile technology.
Gain insight into the challenges of designing better notebooks with shrinking package sizes and growing interface speeds.
Learn about Intel's different architectural and functional design approaches to improve time to market, size, and cost of our WLAN products.
Consider the use of multiple-input multiple-output (MIMO) architecture for the design of a superior wireless communication system with respect to reliability, throughput, and power consumption.
©2006 Intel Corporation
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