Intel Technology Journal
May 2006, Vol. 10, Issue 2

Dear Intel Technology Journal Subscriber:

Intel Technology Journal—May 2006, Vol. 10, Issue 2.
Intel^® Centrino^® Duo mobile technology brings uncompromised performance to new heights, delivering faster performance and improved battery life while maintaining thermal cooling and small form factor. This issue of Intel Technology Journal (Volume 10, Issue 2) discusses the revolutionary technology implemented in the Intel^® Core^™ Duo processor and its supporting platform components. ITJ home page is located on the web at:
http://developer.intel.com/technology/itj/index.htm?ppc_cid=c74

In This Issue

Intel^® Centrino^® Duo Mobile Technology

Preface

Foreword

Intel^® Centrino^® Duo Mobile Technology: The Beginning Of An Era Of Mobile Multi-Core Computing

Current Articles

Introduction

Introduction to Intel^® Core^™ Duo Processor Architecture

Learn about the challenges of building a general-purpose mobile core that provides the highest level of performance while enabling the system to fit into different thermal envelopes

System, Power and Thermals

CMP Implementation in Systems Based on the Intel^® Core^™ Duo Processor

Take a closer look at the first mobile core to implement Core Multi- Processor (CMP) technology on one die, thus maximizing performance and minimizing power consumption.

Power and Thermal Management in the Intel^® Core^™ Duo Processor

Read how power and thermal control methods have become a driving factor in the architecture and design process of platforms based on the Intel^® Core^™ Duo processor.

System Memory Power and Thermal Management in Platforms Built on Intel^® Centrino^® Duo Mobile Technology

Examine techniques that greatly improve the memory power/thermal management in thin and light platforms built on Intel^® Centrino^® Duo mobile technology.

Intel^® 945GMS Express Chipset for Small Form Factor Platform Based on Intel^® Centrino^® Duo Mobile Technology

Gain insight into the challenges of designing better notebooks with shrinking package sizes and growing interface speeds.

Wireless Communication

WLAN System, HW, and RFIC Architecture for the Intel^® PRO/Wireless 3945ABG Network Connection

Learn about Intel's different architectural and functional design approaches to improve time to market, size, and cost of our WLAN products.

MIMO Architecture for Wireless Communication

Consider the use of multiple-input multiple-output (MIMO) architecture for the design of a superior wireless communication system with respect to reliability, throughput, and power consumption.

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